AMAOE BGA Reballing Stencil MTK CPU MU:1-MU:5 Steel Mesh Nozzles Support Android Model : For

Support Android Model : For Samsung Huawei/VIVO/OPPO/Xiaomi/Meizu/Nubia/ Sony/1+/LG

it heats up the tip in under 20 seconds to a selected temperature

1920x1080 60Hz

Handle cable length: ≥100cm

AMAOE BGA Reballing Stencil MTK CPU MU:1-MU:5 Steel Mesh Nozzles Support Android Model : ForAMAOE BGA reballing stencil MTK CPU MU: 1 MU: 2 MU: 3 MU: 4 MU: 5 MU: 6 Template for MTK CPU reballing repair. AMAOE MU1 MU2 MU3 MU4 MU5 MU6 High Quality BGA Reballing Stencil For MTK CPU 6885Z MT6853V 6769V 6779V 6891Z 6758V 6768V RAM MT6885Z, MT8795Z, Dimensity 8100 MT6895Z, Dimensity 900 1080 MT6877V, Dimensity 930 MT6855V, MT6799W, RAM496, Dimensity 9000 MT6983Z, MT8176V, MT6799W RAM Steel mesh. Advantage: 1. Deformation resistant material. 2.